| 摘要 |
PROBLEM TO BE SOLVED: To provide sample preparation method and system for sampling (picking out) only the sample piece containing desired specific area from semiconductor wafer or device chip to mount it on sample stage of assay/measuring device, without going through any manual sample preparation process requiring experience, skill and time. SOLUTION: In this method, FIB (Focused Ion Beam) processing, transport of extracted samples, and also technique for fixing the extracted samples into sample holder are used. This invention will eliminate necessity of experiences or skilled processes from sample preparation for assay/measuring to shorten time period from determination of sampling areas to loading on various systems, comprehensively-enhancing efficiency in assay/measuring. COPYRIGHT: (C)2008,JPO&INPIT
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