发明名称 |
Three-Dimensional Cascaded Power Distribution in a Semiconductor Device |
摘要 |
An IC structure having reduced power loss and/or noise includes two or more active semiconductor regions stacked in a substantially vertical dimension, each active semiconductor region including an active layer. The IC structure further includes two or more voltage supply planes, each of the voltage supply planes corresponding to a respective one of the active layers.
|
申请公布号 |
US2008203445(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
US20080120899 |
申请日期 |
2008.05.15 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BERNSTEIN KERRY;COTEUS PAUL W.;EMMA PHILIP GEORGE;HARTSTEIN ALLAN MARK;KOSONOCKY STEPHEN V.;PURI RUCHIR;RITTER MARK B. |
分类号 |
H01L29/80 |
主分类号 |
H01L29/80 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|