发明名称 |
IMAGE SENSOR MODULE AND THE METHOD OF THE SAME |
摘要 |
Image Sensor Module and the Method of the Same The present invention provides an image sensor module structure comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate and a die having a micro lens disposed within the die receiving cavity. A dielectric layer is formed on the die and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder. |
申请公布号 |
SG144862(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
SG20080005951 |
申请日期 |
2008.01.22 |
申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY INC. |
发明人 |
YANG WEN-KUN;CHANG JUI-HSIEN;WANG TUNG-CHUAN;LIN CHIH-WEI;HSU HSIEN-WEN |
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