| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing semiconductor devices wherein dicing lines can be determined from the rear face side. SOLUTION: After surface-side electrodes (3a, 3b, 3c, ...) are formed on the surface 1b of a wafer 1, the rear face 1a thereof is polished by a polishing grindstone 5. In this case, a pressure is applied to the polishing grindstone 5 downward from above, so that the wafer is elastically deformed and convex strips 9 are produced in the spacings 7 between the surface-side electrodes. After the polishing is completed, when the pressure is released, the wafer returns to the natural shape, and convex strips 13 are produced on the rear face 1a of the wafer 1. The positions of the produced convex strips 13 correspond to the spacings 7 between the surface-side electrodes. Thus, the dicing lines can be determined from the rear face side by measuring the convex strips 13 from the rear face side with a spectroscopic measuring device 19. COPYRIGHT: (C)2008,JPO&INPIT
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