| 摘要 |
An interconnection and packaging method is provided for manufacturing of Lab-on-chip (LOC) and Micro Total Analyses Systems. Different functions, such as biosensors, heaters, coolers, valves, and pumps, are combined in an electronic/mechanical/fluidic module by flip-chip technology using an ultrasound bounding process. A predefined polymeric ring on the chip serves as a seal.
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