发明名称 |
Semiconductor wafer with division guide pattern |
摘要 |
A plurality of semiconductor elements and division regions are provided on a semiconductor subsubstrate. A modification region is provided in the semiconductor substrate. A division guide pattern is provided at least in a portion of each division region. A cleavage produced from a starting point corresponding to the modification region is guided by the division guide pattern.
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申请公布号 |
US2008203538(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
US20080149148 |
申请日期 |
2008.04.28 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
KUMAKAWA TAKAHIRO;UTSUMI MASAKI;MATSUSHIMA YOSHIHIRO;MATSUURA MASAMI |
分类号 |
H01L23/00;H01L21/78 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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