发明名称 |
INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS |
摘要 |
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with components of a tin-containing lead free solder, so that the solderable layer can be totally consumed during soldering, but a barrier layer remains after being placed in contact with the lead free solder during soldering. One or more lead-free solder balls is selectively situated on the solder wetting layer, the lead-free solder balls comprising tin as a predominant component and one or more alloying components.
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申请公布号 |
US2008203585(A1) |
申请公布日期 |
2008.08.28 |
申请号 |
US20080113108 |
申请日期 |
2008.04.30 |
申请人 |
FOGEL KEITH E;GHOSAL BALARAM;KANG SUNG K;KILPATRICK STEPHEN;LAURO PAUL A;NYE HENRY A;SHIH DA-YUAN;ZUPANSKI-NIELSEN DONNA S |
发明人 |
FOGEL KEITH E.;GHOSAL BALARAM;KANG SUNG K.;KILPATRICK STEPHEN;LAURO PAUL A.;NYE HENRY A.;SHIH DA-YUAN;ZUPANSKI-NIELSEN DONNA S. |
分类号 |
H01L21/60;H01L23/52;H01L23/48;H01L23/485;H05K3/34 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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