发明名称 METHOD OF TREATING SUBSTRATE AND PRE-WETTING SOLVENT FOR UPPER-FILM-FORMING MATERIAL TO BE APPLIED TO SURFACE OF RESIST FILM
摘要 <p>A pre-wetting solvent for an upper-film-forming material is applied to the surface of a resist film on a substrate before the upper-film-forming material is applied to the surface of the resist film by spin coating to form an upper-resist film. This pre-wetting solvent comprises at least one compound selected among mono- or di-hydric C&lt;SUB&gt;1-10&lt;/SUB&gt; alcohols, ethers having an optionally halogenated C&lt;SUB&gt;1-8&lt;/SUB&gt; alkyl, and C&lt;SUB&gt;7-11&lt;/SUB&gt; hydrocarbons. The pre-wetting solvent is effective in saving the upper-film-forming material.</p>
申请公布号 WO2008102689(A1) 申请公布日期 2008.08.28
申请号 WO2008JP52435 申请日期 2008.02.14
申请人 TOKYO ELECTRON LIMITED;JSR CORPORATION;YOSHIHARA, KOUSUKE;ISEKI, TOMOHIRO;ICHINO, KATSUNORI;SHIMA, MOTOYUKI;NAKAGAWA, HIROKI 发明人 YOSHIHARA, KOUSUKE;ISEKI, TOMOHIRO;ICHINO, KATSUNORI;SHIMA, MOTOYUKI;NAKAGAWA, HIROKI
分类号 H01L21/027;G03F7/38;G03F7/11 主分类号 H01L21/027
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