METHOD OF TREATING SUBSTRATE AND PRE-WETTING SOLVENT FOR UPPER-FILM-FORMING MATERIAL TO BE APPLIED TO SURFACE OF RESIST FILM
摘要
<p>A pre-wetting solvent for an upper-film-forming material is applied to the surface of a resist film on a substrate before the upper-film-forming material is applied to the surface of the resist film by spin coating to form an upper-resist film. This pre-wetting solvent comprises at least one compound selected among mono- or di-hydric C<SUB>1-10</SUB> alcohols, ethers having an optionally halogenated C<SUB>1-8</SUB> alkyl, and C<SUB>7-11</SUB> hydrocarbons. The pre-wetting solvent is effective in saving the upper-film-forming material.</p>
申请公布号
WO2008102689(A1)
申请公布日期
2008.08.28
申请号
WO2008JP52435
申请日期
2008.02.14
申请人
TOKYO ELECTRON LIMITED;JSR CORPORATION;YOSHIHARA, KOUSUKE;ISEKI, TOMOHIRO;ICHINO, KATSUNORI;SHIMA, MOTOYUKI;NAKAGAWA, HIROKI