| 摘要 |
Disclosed is a liquid resin composition for an electronic element. The composition can be used for sealing of an electronic element. The composition comprises a liquid epoxy resin, a curing agent comprising a liquid aromatic amine, an inorganic filler and at least one component selected from a curing-promoting agent, a silicone polymer particle and a non-ionic surfactant. The composition shows a good fluidability at a narrow gap, produces no void and is excellent in adhesion properties, low stress properties and fillet moldability. Also disclosed is an electronic element device which comprises an element sealed with the composition and therefore has a high reliability (moisture resistance, thermal impact resistance). |
