| 发明名称 |
SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP MOUNTING SUBSTRATE, METHODS OF MANUFACTURING THE DEVICE AND SUBSTRATE, ADHESIVE, AND ADHESIVE DOUBLE COATED FILM |
| 摘要 |
The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25°C of from 10 to 2,000 MPa and a storage elastic modulus at 260°C of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process. |
| 申请公布号 |
EP0959498(B1) |
申请公布日期 |
2008.06.18 |
| 申请号 |
EP19970943157 |
申请日期 |
1997.10.08 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
YAMAMOTO, KAZUNORI;SHIMADA, YASUSHI;KUMASHIRO, YASUSHI;INADA, TEIICHI;KURIYA, HIROYUKI;KANEDA, AIZOU;TOMIYAMA, TAKEO;NOMURA, YOSHIHIRO;HOSOKAWA, YOICHI;KIRIHARA, HIROSHI;KAGEYAMA, AKIRA |
| 分类号 |
H01L23/12;C09J7/02;C09J133/00;C09J163/00;H01L21/58;H01L23/13;H01L23/31;H01L23/498 |
主分类号 |
H01L23/12 |
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