摘要 |
It is intended to provide a substrate structure ensuring a shielding property and a heat discharge property of a resin part that collectively covers a plurality of electronic components and capable of downsizing, thinning, and a reduction in number of components. The substrate structure 20 of the first embodiment is provided with a substrate 21, a plurality of electronic components 22 mounted along the substrate 21, and a resin part 25 that covers the electronic components 22 and is in close contact with the substrate 21. ln the substrate structure 20, the resin part 25 is provided with a reinforcing heat discharge layer 26 covering the electronic components 22 and having a heat conductivity and a reinforcing property and a shield layer 27 covering the reinforcing heat discharge layer 26, and a surface o28 of the shield layer 27 is formed into a predetermined shape corresponding to a surface structure of the display device 30 adjacent to the resin part 25. |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
HAYAKAWA, HARUO;ONO, MASAHIRO;YAMAGUCHI, SEIJI;UDA, YOSHIHIRO;SHINCHI, KAZUHIRO;TOMEKAWA, SATORU;NAKANISHI, KIYOSHI;KUBOTA, KOSUKE;KATAGIRI, ATSUSHI;KOTANI, MOTOHISA;KONISHI, KAZUHIRO;NISHIMURA, EIJI;MATSUKI, TAKEO |