| 摘要 |
<p>The method for soldering electronic components such as an electroluminscent diode on a rigid glass- or ceramic substrate, comprises simultaneously applying ultrasonic waves and heat on the substrate for melting a solder and for chemically connecting a part of the electronic component with glass and other part with electroconductive layer. The method is carried out in a gaseous atmosphere having oxygen (more than 2 vol.%). The substrate has a chemical structure with oxygen atoms. The glass substrate is covered by electro conductive metallic oxide. The method for soldering electronic components such as an electroluminscent diode on a rigid glass- or ceramic substrate, comprises simultaneously applying ultrasonic waves and heat on the substrate for melting a solder and for chemically connecting a part of the electronic component with glass and other part with electroconductive layer. The method is carried out in a gaseous atmosphere having oxygen (more than 2 vol.%). The substrate has a chemical structure with oxygen atoms. The glass substrate is covered by electro conductive metallic oxide. The simultaneous application of ultrasonic waves and heat is carried out by a metallic rod ended with a point or beveled nozzle. The rod is heated by a hot electrical resistance winding at its edge.</p> |
