| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount both types of electronic components such as a bare IC chip supplied while its connecting face is directed upward and an electronic component such as a chip component supplied while its connecting face is directed downward, while the connecting faces of both chips are opposed to a front side of a board, with high precision at a high speed by using a single apparatus. <P>SOLUTION: This electronic component mounting apparatus comprises an upward component supply means for supplying an upward electronic component 3 such as an expand-base 13 and an inverting carrying means 18 for supplying the component 3 to a first component supply position while turning the component 3 upside down arranged at one side in the Y direction of an X direction table 14 for positioning the board 2 in the X direction, a component supply section 7 arranged at the other side in the Y direction for supplying an electronic component 4 having the connection face directed downward to a second component supply position, and a mounting means 26 which is arranged to enable a first mounting head 27 which moves in the Y direction while holding the electronic component 3 to mount it on the substrate 2 and a second mounting head 28 for mounting the electronic component 4 to operate independently. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
