发明名称
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a conductive material with a lamination structure which is suitable for joining terminals of a driving component and a glass board. <P>SOLUTION: The conductive material with a lamination structure includes at least one polymer plastic layer 32 wherein conductive particles are dispersed on its surface. When the conductive material is used to crimp a terminal 5 of a driving component 4 and a terminal 2 of a glass board 1, a junction impedance between the terminals is reduced. Thus, super fine pitch joining is established. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP4102384(B2) 申请公布日期 2008.06.18
申请号 JP20050137781 申请日期 2005.05.10
申请人 发明人
分类号 H01L21/60;H01B5/16 主分类号 H01L21/60
代理机构 代理人
主权项
地址