| 摘要 |
<p>The arrangement has a bond pad (31) electrically connected by an electrical supply line to a housing terminal or an integrated high frequency circuit. A dielectric (21) adjoins the pad so that the pad forms a capacitance with the dielectric and forms an electrically conductive region of the circuit. The capacitance and the supply line, which has an inductance, influence a resonant frequency that is associated with the circuit. An independent claim is also included for an application of a high frequency arrangement in a radar system, a radio communications system and a mobile telephony system.</p> |
