| 摘要 |
The invention relates to a transfer-mold configuration of an automotive electronic control unit, wherein the thermal expansion coefficient of the circuit board 15 is made apparently equal to that of the base member 17-3 to suppress excessive stresses between them. The circuit board 15 and the base member 17-3 are placed in the center of the transfer-mold structure to make thermal stresses symmetrical and thus suppress strains. <IMAGE> |
