| 摘要 |
The present invention relates to a semiconductor device that contains a trench metal-insulator-metal (MIM) capacitor and a field effect transistor (FET). The trench MIM capacitor comprises a first metallic electrode layer located over interior walls of a trench in a substrate, a dielectric layer located in the trench over the first metallic electrode layer, and a second metallic electrode layer located in the trench over the dielectric layer. The FET comprises a source region, a drain region, a channel region between the source and drain regions, and a gate electrode over the channel region. The trench MIM capacitor is connected to the FET by a metallic strap. The semiconductor device of the present invention can be fabricated by a process in which the trench MIM capacitor is formed after the FET source/drain region but before the FET source/drain metal silicide contacts, for minimizing metal contamination in the FET.
|
