发明名称 Method of forming a silicon controlled rectifier structure with improved punch through resistance
摘要 When a high-voltage, such as from an ESD pulse, is placed across a silicon controlled rectifier, which includes an NPN transistor and a PNP transistor that is connected to the NPN transistor, the likelihood of punch through occurring between two regions of the rectifier is substantially reduced by forming the collector of the NPN transistor between the emitter and collector of the PNP transistor.
申请公布号 US7387918(B1) 申请公布日期 2008.06.17
申请号 US20060411397 申请日期 2006.04.26
申请人 NATIONAL SEMICONDUCTOR CORPORATION 发明人 VASHCHENKO VLADISLAV;HOPPER PETER J.;CONCANNON ANN;BEEK MARCEL TER
分类号 H01L21/332 主分类号 H01L21/332
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