| 摘要 |
<p>A method and an apparatus for treating a substrate are provided to improve throughput of the substrate by treating the substrate without aligning the substrate during a substrate transfer process between process units. A substrate treating apparatus includes a load-lock chamber(30), plural process units(40,50,60), and a controller(300). The controller controls a transfer of the substrate between the load-lock chamber and the process units. Each of the process units includes at least one process chamber(42,52,62) and transfer chambers(44,54,64). The transfer chamber includes a robot arm for transferring the substrate. The controller controls the robot arm, such that the substrate, whose notch or flat zone is aligned in a first direction, is transferred from a first process unit, which is adjacent to the load-lock chamber, to an odd-numbered process chamber. The controller controls the robot arm, such that the substrate, whose notch or flat zone is aligned in a second direction, is transferred from the first process unit to an even-numbered process chamber.</p> |
