| 摘要 |
An apparatus for fabricating a semiconductor device is provided to reduce the foot print, and to increase or decrease the number of process chambers for processing wafers according to processes. Vacuum wafer transport units(141,142,143) are disposed on each stage and aligned in a row. A load lock chamber(130) transports wafers into a vacuum state. A primary process chamber(151) is disposed near the vacuum wafer transport units, and processes the wafers transported from the load lock chamber. A first buffer stage(165) is disposed in the vacuum wafer transport units, and loads and unloads the wafers. A first transport robot(144) is disposed between the first process chambers, transports the wafers to the first process chambers from the load lock chamber, and transports the wafers to the first buffer stage from the load lock chamber. A second process chamber(156) is disposed near the vacuum wafer transport units, and processes the wafers transported from the first buffer stage. A second transport robot(146) is disposed between the second process chambers, and transports the wafers which is transported from the first buffer stage, to the second process chamber.
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