发明名称 |
Flip chip metallization method and devices |
摘要 |
Interconnect metallization schemes and devices for flip chip bonding are disclosed and described. Metallization schemes include an adhesion layer, a diffusion barrier layer, a wetable layer, and a wetting stop layer. Various thicknesses and materials for use in the different layers are disclosed and are particularly useful for metallization in implantable electronic devices such as neural electrode arrays. |
申请公布号 |
US7388288(B2) |
申请公布日期 |
2008.06.17 |
申请号 |
US20060607273 |
申请日期 |
2006.12.01 |
申请人 |
UNIVERSITY OF UTAH RESEARCH FOUNDATION;FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWAN |
发明人 |
SOLZBACHER FLORIAN;HARRISON REID;NORMANN RICHARD A.;OPPERMANN HANS-HERMANN;DIETRICH LOTHAR;KLEIN MATTHIAS;TOEPPER MICHAEL |
分类号 |
H01L23/52 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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