发明名称 Processing apparatus and substrate processing method
摘要 A substrate processing apparatus for processing a substrate With a processing fluid is provided. The apparatus includes holding members 60 for holding the substrate W, a chuck member 61 for supporting the holding members 60 and a top-face member 62 approaching the substrate W to cover its surface. In arrangement, since the top-face member 62 is supported by the chuck member 61 , the holding members 60 can rotate together with the top-face member 62 in one body. With this structure, it is possible to reduce the influence of particles on the substrate W and also possible to provided a low-cost substrate processing apparatus occupied as little installation space as possible.
申请公布号 US7387131(B2) 申请公布日期 2008.06.17
申请号 US20030353015 申请日期 2003.01.29
申请人 TOKYO ELECTRON LIMITED 发明人 KURODA OSAMU;TANIYAMA HIROKI;TOSHIMA TAKAYUKI
分类号 B08B3/00;B05C5/00;B05C7/06;B05C11/00;B05C11/02;B05C13/00;B05C13/02;B08B3/12;B08B6/00;H01L21/00;H01L21/687 主分类号 B08B3/00
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