| 发明名称 |
Interconnection designs and materials having improved strength and fatigue life |
| 摘要 |
Methods and designs for increasing interconnect areas for interconnect bumps are disclosed. An interconnect bump may be formed on a substrate such that the interconnect bump extends beyond a contact pad onto a substrate. An interconnect bump may be formed on a larger contact pad, the bump having a large diameter.
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| 申请公布号 |
US7387827(B2) |
申请公布日期 |
2008.06.17 |
| 申请号 |
US20030427168 |
申请日期 |
2003.04.30 |
| 申请人 |
INTEL CORPORATION |
发明人 |
STERRETT TERRY LEE;HARRIES RICHARD J. |
| 分类号 |
B32B3/10;B29C39/02;B29C70/58;B29C70/88;C08J5/10;C08L101/12;H01L23/48;H01L23/485;H05K3/32 |
主分类号 |
B32B3/10 |
| 代理机构 |
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代理人 |
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