| 摘要 |
984,819. Making semi-conductor housings; jointing by forging. STANDARD PRESSED STEEL CO. March 14, 1961 [Jan. 23, 1961], No. 9284/61. Headings B3A and B3H. [Also in Division H1] A method of cold interlocking two members 20, 10, Fig. 1, of different plasticities in end to end engagement, Fig. 4, comprises providing the harder member 20 with a lateral flange 21 and annular recess 24 and cold pressing it on to the softer member 10 whereby the latter flows into and fills the recess and the flange 21 is locked therein under elastic stress. In the manufacture of a semi-conductor such as a silicon rectifier, Fig. 4, a semi-conductor wafer 30 is soldered at 15 to a copper base 10 which has been plated with gold or silver, a lead 31 is soldered to the wafer and a covering of lacquer or latex 33 is applied. An annular recess 11, Fig. 1, in the base receives the flanged end 21 of a steel cap 20 and pressure is then applied in a mechanical or hydraulic press to cause cold flowing of the copper into the recesses 24, 26 thereby producing a hermetic seal. Flange 23 limits the penetration. The flange 21 is bent upwardly upon engagement with the bottom of the groove 11 and locked by the flowing metal under elastic stress. A glass seal 35 is then crimped around the lead 31. In other embodiments, Figs. 10-12 (not shown) two annular recesses 24 are provided in the steel cap and gaskets may be fitted. In another embodiment, Figs. 7, 8, 9 (not shown), a soft tube is interlocked into a solid or hollow hard metal base provided with a flange and annular recess. A separate anvil may be used to deform the flange 21, Fig. 7 (not shown). |
