| 摘要 |
<p>A transfer chamber of semiconductor fabrication equipment, and a method for transferring substrates within the transfer chamber are provided to prevent slipping of a substrate during notch alignment by rotating a transfer robot 180 degrees for loading and unloading the substrate. A transfer chamber(132b) of semiconductor fabrication equipment comprises a housing, a transfer robot(140), and a buffer stage(160). The housing has an inlet leading to a buffer chamber and a process chamber. The transfer robot is installed in the housing for transferring substrates. The buffer stage, on which the substrate transferred by the transfer robot is temporarily loaded, is installed on an upper side of the housing. After loading the substrate on the buffer stage from an inlet side(162) of the buffer stage, the transfer robot is rotated 180 degrees to unload the substrate from an outlet side(164) of the buffer stage.</p> |
