| 摘要 |
<p>A pattern peeling prevention method of a metal photolithography process without using a bottom anti-reflective coating metal is provided to reduce pattern peeling by controlling scanning speed of an LD nozzle for spraying a developing solution on the surface of a photoresist. A pattern peeling prevention method of a metal photolithography process reduces the pattern peeling(30) by controlling the scan speed of an LD nozzle. Wherein, the scan speed is 55 mm/s to 65 mm/s, and the scan speed is applied even when the number times of scanning is 2. Generally, when performing a strip procedure for peeling a photoresist, a selected recipe condition is varied according to the process time, power, oxygen gas, and nitrogen gas. The result of the pattern peeling is changed according the recipe condition. This pattern peeling prevention method extracts experiment data and analyzes factors causing the pattern peeling, so as to minimize the pattern peeling.</p> |
