| 摘要 |
A handling apparatus for semiconductor packages is provided to prevent frequent stop of the handling apparatus and ensure precise detection of the state of the semiconductor package mounted in a tray by taking pictures of the semiconductor packages mounted using a vision camera. A handling apparatus for semiconductor packages comprises a turntable(50), an unloading picker(60), a tray(T), and a vision camera(80). The turntable is where semiconductor packages, each being cut and individualized, are mounted. The unloading picker holds each individual semiconductor package from the turntable for transfer. The tray comprises a plurality of pockets on which the semiconductor packages transferred by the unloading picker are mounted. The vision camera photographs the semiconductor package in each pocket by horizontally moving above the tray for vision inspection of the state of each semiconductor package mounted in the pocket.
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