GRINDING HEAD, GRINDING APPARATUS, GRINDING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A grinding head, a grinding apparatus, a grinding method, and a method of manufacturing a semiconductor device are provided to prevent vibration from being generated from an edge part of a grinding work. A grinding apparatus includes a grinding head(10) and a suction table(110). A grinding work(100) is mounted on the suction table. The grinding head includes a prop(16), a rotation member(12), and a plurality of grinding stones(14). The prop becomes a rotational shaft(X1). The rotation member rotates about the rotational shaft. The grinding stones are arranged in the shape of a ring. The grinding stones contacts with the edge part of the grinding work when the grinding work operates.