| 摘要 |
A semiconductor package is provided to minimize the loading of an input/output pad by differently selecting a position of an input/output pad at every interlayer die to optimize an interconnection line. Input/output of data having a specific bandwidth is performed in an input/out pad. Coding information is inputted into decoding pads. An input/output pad of a specific position is selected from the input/output pads to be enabled with the coding information. A code control unit decodes the coding information to input/output data of a global input/out line according to the decoding result through the input/output pad of the specific position selected out of the input/output pads. The code control unit includes a decoder(27) and plural input/output control units(28A,28B,28C,28D). The decoder decodes the coding information. The input/output control units input and output data of the global input/output line according to the decoding result of the decoder through the selected input/output pad of the specific position. |
