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发明名称
An apparatus and method for attatching tape for manufacturing of semiconductor package
摘要
申请公布号
KR100819791(B1)
申请公布日期
2008.04.07
申请号
KR20020000700
申请日期
2002.01.07
申请人
发明人
分类号
H01L23/02
主分类号
H01L23/02
代理机构
代理人
主权项
地址
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