An apparatus for supporting a semiconductor substrate is provided to prevent particles collected in a vacuum line from polluting a rear of a semiconductor substrate due to a back flow of the particle to a chamber by independently forming the vacuum line providing a vacuum state and a release line for releasing the vacuum state. Plural vacuum holes(11) are formed on a surface of a vacuum chuck(10) on which a semiconductor substrate(2) is received. A vacuum line(20) is communicated with the vacuum hole. The vacuum line provides vacuum between the semiconductor substrate and the vacuum chuck. A release line(30) forms a flow channel independent of the vacuum line. The release line releases the vacuum between the semiconductor substrate and the vacuum chuck. The release line is communicated with a chamber(1) on which the vacuum chuck is provided. The vacuum chuck has plural release holes communicated with the release line. A first valve(21) and a second valve(31) are respectively provided between the vacuum line and the release line to open and shut each line selectively.
