| 摘要 |
This invention provides a production process that can provide a wiring board having the same quality at a high yield in the production of a wiring board by stacking, by hot pressing, a thermoplastic liquid crystal polymer which is an excellent wiring board covering material, onto a wiring substrate. The production process comprises stacking a thermoplastic liquid crystal polymer film onto a wiring substrate with one layer including an electrically conductive circuit being exposed thereon, and hot pressing the assembly to produce a wiring board and is characterized by comprising measuring the viscoelasticity of a thermoplastic liquid crystal polymer of the film at a low frequency in a stacking temperature region, selecting a temperature at which the property value falls within a predetermined range, and conducting hot pressing at the temperature. |
