A camera module is provided to reduce total height of the camera module by connecting a flexible printed circuit board and a ceramic board in a side surface instead of a lower part of the ceramic board using a conductive film. A camera module comprises the followings: an optical unit composed of a housing(2) coupling a lens barrel with multiple lenses; a ceramic board(21) which is closely connected in a lower part of the housing by mounting a passive component(22) and an image sensor in the up and low surface and has a plurality of pads(23) with the same interval; and a flexible printed circuit board(25) for surrounding at least two surfaces among the sides of the ceramic board.