发明名称 FLEXIBLE PRINTED CIRCUIT BOARD
摘要 A flexible printed circuit board is provided to reduce a dielectric loss by forming an insulation layer between a circuit layer and a shield layer. A flexible printed circuit board includes a circuit layer(101), insulation layers(102) and a shield layer(103). A printed circuit pattern is formed on the circuit layer. The insulation layers are formed on both surfaces of the circuit layer. The shield layers are attached to the insulation layers. The insulation layers and the shield layers are arranged to be symmetrical each other with the circuit layer between them. The circuit layer includes a base layer(111), a first adhesive layer(115) and a first protective layer(117). The first adhesive layer is applied on the circuit pattern. The first protective layer is attached to the base layer by using the adhesive layer.
申请公布号 KR100770832(B1) 申请公布日期 2007.10.26
申请号 KR20060059531 申请日期 2006.06.29
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 BAEK, JAE MYUNG;YUN, IN KUK
分类号 H05K1/02 主分类号 H05K1/02
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