| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for preventing warpage in a jig for manufacturing a capacitor, where different components are mounted on a surface and a rear surface. SOLUTION: The jig for manufacturing the capacitor includes a long size substrate with the different chip components mounted thereon, by which a semiconductor layer is formed by an energizing method on a plurality of conductive bodies with a dielectric layer formed on the surface. The method for preventing the warpage in the jig for manufacturing the capacitor allows arrangement places on the surface and the rear surface in an upper widthwise direction to be within a specified range with respect to the widthwise direction of the substrate concerning the jig. COPYRIGHT: (C)2007,JPO&INPIT
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