| 摘要 |
PROBLEM TO BE SOLVED: To provide a reduced-pressure drying unit to be used for forming a coating film comprising a resist film, for example, on a semiconductor wafer, by which film thickness homogeneity is enhanced by the control of a temperature within a wafer face. SOLUTION: The reduced-pressure drying unit of the present invention is composed of a sealed container provided with an install part to install a substrate coated with a coating liquid comprising a mixture of a component of a coating film and a solvent, a heating means for heating the substrate installed on the install part, an evacuation means connected via an exhaustion path to the sealed container for generating a reduced-pressure atmosphere within the sealed container and thus volatilizing the solvent from the coating liquid on the substrate, and a material being provided on the install part and having a heat conductivity differing from that of the install part. With such a composition, the wafer temperature can be controlled in the wafer face using differences in heat conductivity, so that film thickness homogeneity within the face is improved. COPYRIGHT: (C)2007,JPO&INPIT
|
