发明名称 |
Semiconductor chip package with a metal substrate and semiconductor module having the same |
摘要 |
A semiconductor chip package includes: a metal substrate having a core; a semiconductor chip mounted on the metal substrate; and a heat sink extending from the core.
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申请公布号 |
US2007108599(A1) |
申请公布日期 |
2007.05.17 |
申请号 |
US20060477547 |
申请日期 |
2006.06.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
IM YUN-HYEOK;YOO JAE-WOOK |
分类号 |
H01L23/34 |
主分类号 |
H01L23/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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