发明名称 |
Semiconductor integrated circuit having multiple semiconductor chips with signal terminals |
摘要 |
A semiconductor integrated circuit includes: a package; semiconductor chips in the package including a signal terminal; and a wiring connecting signal terminals. One semiconductor chip is a test object chip including a probe terminal and a test object terminal. The probe terminal connects to an external terminal for testing the test object terminal. The test object chip further includes: a common wiring for connecting the probe terminal and the test object terminal; a first switch for connecting/disconnecting the probe terminal and the common wiring; a second switch for connecting/disconnecting the test object terminal and the common wiring; and a test signal interrupting element for interrupting the test signal to be inputted into an input circuit of the probe terminal. |
申请公布号 |
US2007108998(A1) |
申请公布日期 |
2007.05.17 |
申请号 |
US20060586560 |
申请日期 |
2006.10.26 |
申请人 |
DENSO CORPORATION |
发明人 |
ITO NAOKI;ISHIHARA HIDEAKI;TESHIMA YOSHINORI;KOBAYASHI CHIKARA |
分类号 |
G01R31/02 |
主分类号 |
G01R31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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