| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device and a method for effectively manufacturing the same device. SOLUTION: The manufacturing method of semiconductor device comprises the steps of preparing for a semiconductor module 100 including a plurality of external terminals 50, providing a positive photosensitive resin 60 to the semiconductor module 100 to continuously cover the external terminals 50, and forming a plurality of resin layers 70 arranged independent with each other by partly removing the photosensitive resin 60 through the exposure process and development process to cover the base end of any external terminal 50 and to expose the upper end thereof. The photosensitive resin 60 is formed to include the first portion 61 covering the upper end of the external terminal 50, the second portion 62 covering the base end, and the third portion 63 provided at the external side of the second portion. The photosensitive resin 60 is sensed up to the bottom surface only at the first and third portions 61, 63 with the exposure process. The first and third portions 61, 63 are removed with the development process. COPYRIGHT: (C)2007,JPO&INPIT
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