| 摘要 |
A semiconductor device includes: a package; two semiconductor chip fixing parts located adjacently to each other in the package; and first and the second semiconductor chips, each of which is fixed on the semiconductor chip fixing part and has a field effect transistor formed therein. A gate lead G 1 , a source lead S 1 , and a drain lead D 2 are arranged from left to right on the first surface of the package and a drain lead D 1 , a source lead S 2 , and a gate lead G 2 are arranged from left to right on the second surface. A gap between the source lead S 1 and the drain lead D 2 is two times a gap between the gate lead G 1 and the source lead S 1 , and a gap between the drain lead D 1 and the source lead S 2 is two times a gap between the source lead S 2 and the gate lead G 2.
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