| 摘要 |
Methods and apparatus are presented to release stiction between suspended structures and the underlying surface in freestanding MEMS structures. A nanosecond rise time stress wave is launched on the backside of the Si substrate by impinging a 2.5 ns-duration Nd:YAG laser pulse onto a 3 mm-dia area. The compressive stress wave propagates through the Si substrate and arrives at the site of several stiction-failed cantilevers on the front Si surface. The compressive stress wave propagates through the cantilevered structures and is reflected into a tensile wave from their free surfaces. The returning tensile wave pries off the interface, releasing the cantilevers.
|
