| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for evaluation to quicken evaluation by keeping down man hours taken for performing secondary mounting evaluation on the semiconductor device for evaluation; and to provide a manufacturing method of the semiconductor device for evaluation. <P>SOLUTION: This semiconductor device 11 for evaluation is used for performing secondary mounting evaluation and comprises a dummy chip 12 with bonding pads 23 formed thereon, an interposer 15 loaded with the dummy chip 12, solder balls 14 provided on the interposer 15, and bonding wires 13 for performing electrical connection from the bonding pads 23 down to the solder balls 14. Since the dummy chip 12 does not require any functions as an IC chip which is a product, the bonding pads 23 are formed by an ink jet method so as to have desired shapes at desired positions. This makes it possible to quickly manufacture the semiconductor device 11 for evaluation and to quickly perform the mounting evaluation. <P>COPYRIGHT: (C)2007,JPO&INPIT |
