| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase a degree of freedom in selecting a substrate material for a piezoelectric/electrostrictive film type device. <P>SOLUTION: The piezoelectric/electrostrictive film is formed on a solid-phase carrier 2, the piezoelectric/electrostrictive film including an incompletely bonding region having a predetermined pattern on the solid-phase carrier 2, and a bonding region which bonds on the surface of the solid-phase carrier so as to separate the incompletely bonding region. By joining the piezoelectric/electrostrictive film 10 to a substrate, and separating the solid-phase carrier and the piezoelectric/electrostrictive film 10 in the bonding region 30; the incompletely bonding region 20 is transferred onto the substrate. The piezoelectric/electrostrictive film type device is fabricated using the transferred incompletely bonding region 20 as a piezoelectric/electrostrictive film. <P>COPYRIGHT: (C)2007,JPO&INPIT |
