发明名称 MULTIPIECE WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To improve reliability in mounting of a wiring board whose side surface is a mounting surface. SOLUTION: A plurality of wiring boards 102 are arranged in a line. A pair of split grooves 107 are formed to sandwich the plurality of wiring boards 102 along the outer edges of the plurality of wiring boards 102, in the array direction of the plurality of wiring boards 102. A slit 103 is so provided between a plurality of wiring boards 102 that the side surfaces mounting the plurality of wiring boards 102 are exposed. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007123521(A) 申请公布日期 2007.05.17
申请号 JP20050313189 申请日期 2005.10.27
申请人 KYOCERA CORP 发明人 MATSUWAKA TOSHINORI
分类号 H05K1/02 主分类号 H05K1/02
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