| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board and a method of manufacturing the same, wherein a micro-fabrication and a high density in a wiring pattern are possible. SOLUTION: The printed wiring board has a board 1, insulating layers 12a, 12b formed on both faces of the board 1, a hole 14 piercing the board 1 and the insulating layers 12a, 12b, a conductive layer 22 formed so as to coat the inner face of the hole 14, a filler 20 for filling the hole 14 without filling the end face of the conductive layer 22, and wiring layers 26, 27 which are connected to the end face of the conductive layer 22 and are formed on the filler 20 and the respective insulating layers 12a, 12b. The end face of the conductive layer 22 is formed at the substantially same position as surfaces of the insulating layers 12a, 12b or at a position on the board side rather than the surfaces of the insulating layers 12a, 12b. COPYRIGHT: (C)2007,JPO&INPIT
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