| 摘要 |
PROBLEM TO BE SOLVED: To provide a smoother apparatus which, after a substrate such as a printed wiring board or one wherein a surface mounting device is mounted is laminated or covered with resin, the height is conrolled by passing the substrate through a pair of smoothing rollers with gaps, and, in case when a multilayer wiring board is manufactured, the resin is surely spread to the skirt of a conductor column on the substrate, and in case when the printed wiring board to which the surface mounting device is mounted is sealed by resin, the resin is also surely spread to the skirt of the surface mounting device, so as to ensure the formation of an airtight space. SOLUTION: After the printed wiring board or one wherein a surface mounting device is mounted is laminated or covered with resin, a means to smooth the resin with a flow promotion roller is provided before the resin passes through a pair of smoothing rollers with gaps. COPYRIGHT: (C)2007,JPO&INPIT
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