METHOD OF MANUFACTURING WIRING BOARD, AND PLATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board by which the wiring board high in reliability can efficiently be formed while taking environment into consideration, and to provide a plating apparatus. SOLUTION: The method of manufacturing the wiring board includes the formation of a lead-free solder layer to cover at least a part of a tin layer 24 by facing a wiring pattern 20 wherein at least a part of the surface is the tin layer 24 and an anode 42 each other in a plating bath 45, bringing cathodes arranged at both ends of the plating bath 45 into contact with the wiring pattern and electrolyzing. An interval between the wiring pattern 20 and the anode 42 is set to 0.02-0.1 m and the distance between the cathodes 44 is set to≤2 m. The electroplating process is carried out so that the current density of current flowing in the wiring pattern 20 is 200-1,000 A/m2. COPYRIGHT: (C)2007,JPO&INPIT