| 摘要 |
A semiconductor structure is disclosed. The semiconductor structure includes a substrate, a bond pad, a fuse structure and a protection layer. The substrate has a pad region and a fuse region. The bond pads are disposed in the pad region of the substrate. The fuse structure is disposed in the fuse region of the substrate. The protection layer is disposed on the substrate to cover the pad region and the fuse region so that the bond pads are prevented from oxidation.
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