| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is improved in its packaging properties, and to provide its manufacturing method. <P>SOLUTION: The semiconductor device comprises a package substrate 3, of which the base member is formed with resin; a semiconductor chip 1 mounted on a principal surface 3a of the package substrate 3; tape substrates 9 laminated over a plurality of stages on the package substrate 3 and each being electrically connected with the lower stage substrate via a plurality of solder balls 15; a second-stage chip 21, a third-stage chip 25, and a fourth stage chip 26, each being mounted on the tape substrate 9 of each stage; and a plurality of solder balls 8 provided on a rear surface 3b of the package substrate 3. On the principal surface 3a of the package substrate 3 disposed at the lowermost stage, the semiconductor chip 1 is resin-sealed, and a sealed structure 6 is formed by resin molding. The sealed structure 6 is disposed in between the lowermost stage package substrate 3 and the tape substrate 9 laminated on the former. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
