摘要 |
PROBLEM TO BE SOLVED: To enable provision of many circuit elements on a chip even when a reinforcing dummy terminal is provided in order to keep balance upon pressure contact. SOLUTION: A semiconductor device 10 for use in COG (Chip On Glass) mounting comprises a group of output terminals 12f provided in the form of a first pattern in the vicinity of one end of a chip; and dummy terminals 12d provided in the vicinity of one end of the chip, provided in a region different from the region having the output terminal group 12f provided therein, and also provided in the form of a second pattern different from the first pattern. The width of the second pattern is narrower than the width of the first pattern. A power supply 14 is provided in the vicinity of the dummy terminals 12d and next to the output terminal group 12f in the lengthwise direction. COPYRIGHT: (C)2007,JPO&INPIT |