发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To enable provision of many circuit elements on a chip even when a reinforcing dummy terminal is provided in order to keep balance upon pressure contact. SOLUTION: A semiconductor device 10 for use in COG (Chip On Glass) mounting comprises a group of output terminals 12f provided in the form of a first pattern in the vicinity of one end of a chip; and dummy terminals 12d provided in the vicinity of one end of the chip, provided in a region different from the region having the output terminal group 12f provided therein, and also provided in the form of a second pattern different from the first pattern. The width of the second pattern is narrower than the width of the first pattern. A power supply 14 is provided in the vicinity of the dummy terminals 12d and next to the output terminal group 12f in the lengthwise direction. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007123709(A) 申请公布日期 2007.05.17
申请号 JP20050316540 申请日期 2005.10.31
申请人 NEC ELECTRONICS CORP 发明人 MATSUURA KAZUYOSHI
分类号 H01L21/82;G02F1/1345;H01L21/3205;H01L21/60;H01L21/822;H01L23/52;H01L27/04 主分类号 H01L21/82
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